Siemens Simcenter FloEFD 2020.1.0 v4949 Standalone x64 Multilingual






Siemens Simcenter FloEFD 2020.1.0 v4949 Standalone x64 Multilingual | 6.0 GB


Language: English, Deutsch, Français, 中文, 日本語, Русский.


Siemens Digital Industries Software announces the latest release of its Simcenter FLOEFD software, a CAD-embedded computational fluid dynamics (CFD) tool. The latest version offers new modules and improvements that can improve accuracy and solve rates.

The new Electronics Cooling Center module in Simcenter FLOEFD combines existing best electronics-specific capabilities and integrates new ones from Simcenter Flotherm software inside the user-friendly CAD-embedded interface to enhance electronics cooling functionality. A second new module helps users create a compact Reduced Order Model (ROM) that solves at a faster rate, while still maintaining a high level of accuracy. Its package creator helps users create thermal models of electronics packages easily and quickly. The Power Electrification module can now simulate an electrical device as an electro-thermal compact model, which can save significant user and computational time.


BCI-ROM Feature
The Boundary Condition Independent Reduced Order Model (BCI-ROM) extracts a dynamic compact thermal model for a range of heat transfer coefficient values defined in the Simcenter FLOEFD model. Such models can solve up to 40,000 times faster than a 3D CFD simulation while maintaining predictive accuracy in space and time. The models can be used for simulations in MATLAB or GNU Octave. To access this functionality you will need either the "Simcenter FLOEFD BCI-ROM + Package Creator" or "Simcenter FLOEFD Electronics Cooling Center" modules.

Thermal Netlist Extraction
The thermal netlist extraction converts a full Simcenter FLOEFD project into a thermal netlist using Reduced Order Model (ROM) technology. This thermal netlist is then linked to an electrical netlist prior to electro-thermal analysis. The export function uses the spice format (*.sp file) for use by electro-thermal system tools including Mentor Graphics' Eldo, SystemVision Cloud and other tools supporting the spice format. This functionality is only available in the "Simcenter FLOEFD BCI-ROM + Package Creator" or "Simcenter FLOEFD Electronics Cooling Center" modules.

Simcenter FLOEFD Package Creator Tool
The package creator is a tool that specializes in rapid creation of thermal models of electronic packages for use in Simcenter FLOEFD. The tool can be started from the Windows start menu or from within Simcenter FLOEFD. To create a package, you can specify various components, such as the encapsulant, die, die-attach, leadframe, die-attach pad and bond wires for a more accurate thermal model. This functionality is only available in the "Simcenter FLOEFD BCI-ROM + Package Creator" or "Simcenter FLOEFD Electronics Cooling Center" modules.

Electrical Element
This new feature is a thermo-electric compact model that allows users to add a component into a direct current (DC) electro-thermal calculation by the given component's electrical resistance. The corresponding Joule heat is calculated and applied to the body as a heat source. There are two types of electrical elements, resistors and wires: the resistor element uses the total electrical resistance provided and the wire element automatically calculates the resistance based on the wire's material properties, length and cross-section area. Optionally you may also specify the thermal resistance of the wire's insulator. To use this functionality, you'll need either the "Simcenter FLOEFD Electronics Cooling Center" or "Simcenter FLOEFD Power Electrification" module.

Simcenter FLOEFD BCI-ROM + Package Creator Module
This new module comprises of the three new functionalities: BCI-ROM, Thermal Netlist and the Package Creator. In addition, the PCB compact model which was previously only available in the Simcenter FLOEFD Electronics Cooling module has been added to this module. This module is available for all Simcenter FLOEFD CFD CAD integrations.

Simcenter FLOEFD Electronics Cooling Center Module
This new module offers the ultimate solution for anyone who wants to dig deep into the electronics cooling world. It comprises of the functionalities of several modules: the Simcenter FLOEFD Electronics Cooling module, Simcenter FLOEFD EDA Bridge module, Simcenter FLOEFD T3STER Auto Calibration module plus the new Simcenter FLOEFD BCI-ROM + Package Creator module and the new Electrical Elements feature. With this package, you are fully equipped to face the toughest electronics cooling challenges inside your preferred CAD interface. And to ensure you have maximum flexibility, each of the modules listed above is still available separately. The Simcenter FLOEFD Electronics Cooling Center module is available for all Simcenter FLOEFD CFD CAD integrations.

ECXML Import
The Electronics Cooling XML (ECXML) format is an open neutral file format for the exchange of electronics cooling design models among different thermal simulation toolsets.

API Enhancements
The Simcenter FLOEFD API has been extended to include the ability to add thermal contact resistance and change the gravity as well as the default solid material from any API based interface to Simcenter FLOEFD CFD simulation software. This enables users to automate even more tasks through Visual Basic, Visual Basic for Applications and Visual C++ scripts and programs such as MS Excel.

Battery Model Extraction
The new battery model extraction capability can be used to extract the Equivalent Circuit Model (ECM) input parameters from experimental data. This enables you to get to the required input parameters faster and easier. This functionality is only available in the "Simcenter FLOEFD Power Electrification" module.

3rd Order Model for ECM Battery Model
In addition to the zero, first and second-order ECM battery models, a third-order model definition has been added; thereby offering even more accuracy for battery simulations. This functionality is only available in the "Simcenter FLOEFD Power Electrification" module.

Multiple Edit for Batteries
The multiple edit definition has been added for the battery feature. This way changes in the battery definition can be applied to all cells rather than each cell individually. This functionality is only available in the "Simcenter FLOEFD Power Electrification" module.

Import Descriptions from Scene
The new post-processing template (*.efdscene file) allows you to specify the result features such as Descriptions, parameters, etc. that you may want to create automatically in other models and save them in a template. This enables you to re-use these settings in any other model or project directly by using the saved template.

Rotating Angle Goal
This new goal can be created within the rotating region definition menu. It helps to see the angle of the rotating geometry at each iteration, with respect to its original position at the start of the simulation.

Shock Wave Stabilization
For simulations with shock waves with Mach numbers larger than five, this option allows you to dampen oscillations in the solver run for a better convergence behavior.

Custom Visualization Parameter Interdependency
User-defined custom visualization parameters for post-processing can now depend on other user-defined parameters. This helps to define parameters that are depending on other, already defined parameters.

Create Curve for CATIA V5
It is now also possible to create curves from flow trajectories in Simcenter FLOEFD for CATIA V5.

Rebranding of Simcenter FLOEFD
Although already used in public-facing posts and other marketing material, the rebranding of "FloEFD" to "Simcenter FLOEFD" and "FloEFDView" to "Simcenter FLOEFD Viewer" is now complete in the software and corresponding technical documentation.

New CAD Version Supported
With the latest release, support for Siemens NX 1911 is now provided to ensure continuity of access.

Simcenter FLOEFD is part of the Simcenter portfolio of simulation and test solutions that enables companies optimize designs and deliver innovations faster and with greater confidence. Simcenter FLOEFD helps engineers simulate fluid flow and thermal problems quickly and accurately within their preferred CAD environment. Due to its unique technology, it can reduce the overall simulation time by up to 75%.

This new release provides a range of new features and enhancements - from electrical elements to two new modules for electronics cooling applications with a lot of new capabilities.
Hiro Yukioka Senior Engineer/Technical Specialist from Mercury Marine discusses how Simcenter FLOEFD aids the engineering process of designing an Intercooler Filter.

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.


Product: Siemens Simcenter FloEFD
Version: 2020.1.0 v4949 Standalone
Supported Architectures: x64
Website Home Page :

Code:

Download: Siemens Simcenter FloEFD 2020

Language: multilanguage
System Requirements: PC *
Supported Operating Systems: *
Size: 6.0 Gb

Supported Platform
- Microsoft Windows 7 Professional, Ultimate or Enterprise 64-bit edition, Microsoft Windows 10 Pro or Enterprise 64-bit (tested with v1809)
- For solver: Microsoft Windows 2012 Server x64, Windows 2012 Server R2 x64, Windows Server 2016, Windows Server 2016 with HPC Pack 2016
- Microsoft Office 2013; Microsoft Office 2010; Microsoft Office 2007
- Microsoft Windows Media Player 7.0 or higher
- Ethernet network adapter
- Mouse or other pointing device
- DVD-ROM drive
- 4 GB RAM minimum, more recommended
- 6 GB of free hard disk space, more required for simulation models



DOWNLOAD LINKS:

Siemens Simcenter FloEFD 2020.1.0 v4949 for Creo x64






Siemens Simcenter FloEFD 2020.1.0 v4949 for Creo x64 | 741 MB


Language: English, Deutsch, Français, 中文, 日本語, Русский.


Siemens Digital Industries Software announces the latest release of its Simcenter FLOEFD software for Creo, a CAD-embedded computational fluid dynamics (CFD) tool. The latest version offers new modules and improvements that can improve accuracy and solve rates.

The new Electronics Cooling Center module in Simcenter FLOEFD combines existing best electronics-specific capabilities and integrates new ones from Simcenter Flotherm software inside the user-friendly CAD-embedded interface to enhance electronics cooling functionality. A second new module helps users create a compact Reduced Order Model (ROM) that solves at a faster rate, while still maintaining a high level of accuracy. Its package creator helps users create thermal models of electronics packages easily and quickly. The Power Electrification module can now simulate an electrical device as an electro-thermal compact model, which can save significant user and computational time.

New Features
The following new features are available in this release.
- BCI ROM. Reduced Order Modelling is an approach to derive a dynamic compact thermal model from a thermal simulation model. The objective is to create a model that solves much faster, while maintaining predictive accuracy in space and time. The Boundary Conditions Independent (BCI) ROM allows you to create the compact model by providing locations of the heat sources (as volume heat sources), temperature monitor points (as point goals), heat transfer coefficients on bounding faces (as wall boundary condition) and specifying a range of heat transfer coefficient minimum and maximum values. After creating the model, the temperature in the monitor points are obtained much faster (in second and minutes) by given exact power dissipation (can be time-dependent) and heat transfer coefficients. The BCI-ROM is a conduction-only model, radiation and Joule heating are not supported. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.

- Thermal Netlist Extraction. Using BCI ROM you can convert a task into a thermal netlist (in *.sp format) which can be used by a Spice based electro thermal system simulation tool such as Mentor Eldo. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.

- Package Creator. Package Creator is a new tool that specializes in the rapid creation of electronic package models based on a library of IC package templates and user customization. An IC package model contains geometry, material and heat sources definition. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.
- Electrical Element. A thermo-electrical compact model allows the addition of a component into a DC electro-thermal calculation by the given component's electrical resistance. The corresponding Joule heat is calculated and applied to the body as a heat source so you don't need to have a detailed model of a component to take it into account in the electro-thermal DC calculation. A Resistor element uses the total electrical resistance specified. A Wire element automatically calculates the resistance based on a wire's material, length and cross sectional area, and optionally you can specify the thermal resistance of the wire's insulator. A Joint element virtually (no body is necessary) connects two faces. Requires "Power Electrification" or "Electronics Cooling Center" module.

- ECXML Import. You can now import Electronics Cooling XML, an open neutral file format to share design models among different thermal simulation toolsets.
- Battery Model Extraction. Extraction of Equivalent Circuit Model (ECM) input parameters from experimental data. Requires "Power Electrification" module.
- Battery ECM of 3rd order. The 3 rd order ECM is now supported for battery simulation. Requires "Power Electrification" module.
- Multiple Edit for batteries. Multiple edit definition is available for a Battery feature. Requires "Power Electrification" module.
- Import Descriptions from Scene. You can copy a results feature (Descriptions, parameters, etc) to other models by using Scene template or Scene Image (*.efdscene).
- Improvement of setting the Custom Visualization parameters. User-defined postprocessing parameters can now depend on other user-defined postprocessing parameters.
- Rotating angle associated goal. Rotating Region has a new Rotating Angle goal associated with the feature.
- Shock waves stabilization. In case of shock waves with the Mach number greater than five enabling this option allows to dampen oscillations.
- API Enhancement. You can now add the Thermal Contact Resistance, change the Gravity, and change the Default Solid.
- Rebranding FloEFD. FloEFD is now renamed to Simcenter FLOEFD software. FloEFDView is renamed to Simcenter FLOEFD Viewer. FLOEFD icon in Start menu is now located into Simcenter FLOEFD folder. The default files location in the Program Files folder is not changed, so API scripts referring to the setup folder are not affected.
- Simcenter FLOEFD BCI-ROM and Package Creator module. The module includes the following capabilities:
. BCI-ROM and Thermal Netlist
. Package Creator
. PCB compact model (previously available only in the Electronics Cooling module).
- Simcenter FLOEFD Electronics Cooling Center (ECC) module. The module includes the following best in class capabilities for powerful and comprehensive electronics cooling analysis from Simcenter FLOEFD and Simcenter Flotherm software:
. EDA Bridge and Smart PCB
. BCI ROM and Thermal Netlist
. Package Creator
. PDML Import
. Network Assembly and Two-resistor compact models
. Simcenter T3STER software AutoCalibration
. PCB compact model
. Heat Pipe compact model
. Joule Heating
. Electrical Element compact model
All existing modules whose functionality is available in ECC module (EDA Bridge, AutoCalibration, Electronics Cooling, and Power Electrification) are maintained as separate modules.

FloEFD for Creo is a full-featured 3D fluid flow, heat transfer analysis package-totally integrated into PTC Creo (and Pro/ENGINEER). FloEFD is both fast to learn and fast to use because it doesn't come with the numerical complexity and meshing overheads of traditional high-end computational fluid dynamics (CFD). It is the only CFD analysis tool that is truly embedded into Creo Parametric.

Unlike other 3rd party CFD programs, FloEFD for Creo works directly with native Creo geometry - with no translation or copies - in order to keep pace with on-going design changes. FloEFD for Creo has the same "look and feel" so you can focus on solving your problem instead of learning a new environment.

By using the Creo geometry directly and solid model information such as features and parameters, you can simulate your designs in real-world conditions. Direct use of native geometry is an extremely powerful feature since it provides you with functionality that is not easily offered by other CFD programs. Because you're using the same exact geometry for CAD and analysis, you maintain one set of data across your product design process, and your analysis is always in tune with your design.

Watch this video to learn how FloEFD can be used as a CFD tool embedded within your CAD system, in order to provide a degree of CAD preparation. This short 5 minute video will explain how CFD features embedded in your CAD system can make things much simpler and efficient for you.

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.


Product: Siemens Simcenter FloEFD
Version: 2020.1.0 v4949 for Creo
Supported Architectures: x64
Website Home Page :

Code:

Download: Siemens Simcenter FloEFD 2020

Language: multilanguage
System Requirements: PC *
Supported Operating Systems: *
Software Prerequisites: *
Size: 741.3 mb

Supported Platform
- Microsoft Windows 7 Professional, Ultimate or Enterprise 64-bit edition,Microsoft Windows 10 Pro or Enterprise 64-bit (tested with v1809)
- For solver: Microsoft Windows 2012 Server x64, Windows 2012 Server R2 x64, Windows Server 2016 with HPC Pack 2016
- Microsoft Office 2013, Microsoft Office 2010, Microsoft Office 2007
- Microsoft Windows Media Player 7.0 or higher
Creo Parametric v2 (recommended datecode M250)
Сreo Parametric v3 (recommended datecode M160)
Creo Parametric v4 (recommended datecode M070)
Creo Parametric v5 (recommended datecode v5.0.5.0)
Creo Parametric v6 (recommended datecode v6.0.4.0)
- Ethernet network adapter
- Mouse or other pointing device
- DVD-ROM drive
- 4GB RAM minimum, more recommended
- 1GB of free hard disk space, more required for simulation models



DOWNLOAD LINKS:

Siemens Simcenter FloEFD 2020.1.0 v4949 for NX series x64






Siemens Simcenter FloEFD 2020.1.0 v4949 for NX series x64 | 701 MB


Language: English, Deutsch, Français, 中文, 日本語, Русский.


Siemens Digital Industries Software announces the latest release of its Simcenter FLOEFD software for NX series, a CAD-embedded computational fluid dynamics (CFD) tool. The latest version offers new modules and improvements that can improve accuracy and solve rates.

The new Electronics Cooling Center module in Simcenter FLOEFD combines existing best electronics-specific capabilities and integrates new ones from Simcenter Flotherm software inside the user-friendly CAD-embedded interface to enhance electronics cooling functionality. A second new module helps users create a compact Reduced Order Model (ROM) that solves at a faster rate, while still maintaining a high level of accuracy. Its package creator helps users create thermal models of electronics packages easily and quickly. The Power Electrification module can now simulate an electrical device as an electro-thermal compact model, which can save significant user and computational time.

New Features
The following new features are available in this release.
- BCI ROM. Reduced Order Modelling is an approach to derive a dynamic compact thermal model from a thermal simulation model. The objective is to create a model that solves much faster, while maintaining predictive accuracy in space and time. The Boundary Conditions Independent (BCI) ROM allows you to create the compact model by providing locations of the heat sources (as volume heat sources), temperature monitor points (as point goals), heat transfer coefficients on bounding faces (as wall boundary condition) and specifying a range of heat transfer coefficient minimum and maximum values. After creating the model, the temperature in the monitor points are obtained much faster (in second and minutes) by given exact power dissipation (can be time-dependent) and heat transfer coefficients. The BCI-ROM is a conduction-only model, radiation and Joule heating are not supported. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.

- Thermal Netlist Extraction. Using BCI ROM you can convert a task into a thermal netlist (in *.sp format) which can be used by a Spice based electro thermal system simulation tool such as Mentor Eldo. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.

- Package Creator. Package Creator is a new tool that specializes in the rapid creation of electronic package models based on a library of IC package templates and user customization. An IC package model contains geometry, material and heat sources definition. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.
- Electrical Element. A thermo-electrical compact model allows the addition of a component into a DC electro-thermal calculation by the given component's electrical resistance. The corresponding Joule heat is calculated and applied to the body as a heat source so you don't need to have a detailed model of a component to take it into account in the electro-thermal DC calculation. A Resistor element uses the total electrical resistance specified. A Wire element automatically calculates the resistance based on a wire's material, length and cross sectional area, and optionally you can specify the thermal resistance of the wire's insulator. A Joint element virtually (no body is necessary) connects two faces. Requires "Power Electrification" or "Electronics Cooling Center" module.

- ECXML Import. You can now import Electronics Cooling XML, an open neutral file format to share design models among different thermal simulation toolsets.
- Battery Model Extraction. Extraction of Equivalent Circuit Model (ECM) input parameters from experimental data. Requires "Power Electrification" module.
- Battery ECM of 3rd order. The 3 rd order ECM is now supported for battery simulation. Requires "Power Electrification" module.
- Multiple Edit for batteries. Multiple edit definition is available for a Battery feature. Requires "Power Electrification" module.
- Import Descriptions from Scene. You can copy a results feature (Descriptions, parameters, etc) to other models by using Scene template or Scene Image (*.efdscene).
- Improvement of setting the Custom Visualization parameters. User-defined postprocessing parameters can now depend on other user-defined postprocessing parameters.
- Rotating angle associated goal. Rotating Region has a new Rotating Angle goal associated with the feature.
- Shock waves stabilization. In case of shock waves with the Mach number greater than five enabling this option allows to dampen oscillations.
- API Enhancement. You can now add the Thermal Contact Resistance, change the Gravity, and change the Default Solid.
- Rebranding FloEFD. FloEFD is now renamed to Simcenter FLOEFD software. FloEFDView is renamed to Simcenter FLOEFD Viewer. FLOEFD icon in Start menu is now located into Simcenter FLOEFD folder. The default files location in the Program Files folder is not changed, so API scripts referring to the setup folder are not affected.
- Simcenter FLOEFD BCI-ROM and Package Creator module. The module includes the following capabilities:
. BCI-ROM and Thermal Netlist
. Package Creator
. PCB compact model (previously available only in the Electronics Cooling module).
- Simcenter FLOEFD Electronics Cooling Center (ECC) module. The module includes the following best in class capabilities for powerful and comprehensive electronics cooling analysis from Simcenter FLOEFD and Simcenter Flotherm software:
. EDA Bridge and Smart PCB
. BCI ROM and Thermal Netlist
. Package Creator
. PDML Import
. Network Assembly and Two-resistor compact models
. Simcenter T3STER software AutoCalibration
. PCB compact model
. Heat Pipe compact model
. Joule Heating
. Electrical Element compact model

All existing modules whose functionality is available in ECC module (EDA Bridge, AutoCalibration, Electronics Cooling, and Power Electrification) are maintained as separate modules.
FloEFD for NX is a powerful computational fluid dynamics (CFD) analysis tool that is embedded into Siemens NX. It enables design engineers to frontload CFD by moving simulation early into the design process where it is more cost effective to identify and fix problems.

Extend the power of Siemens NX to optimize product performance and reliability for fluid flow and heat transfer effects. With its unique combination of intuitive interface, and fast as well as accurate technology, Simcenter FLOEFD for NX can be inserted into your current design process without any disruption, streamlining your workflow and improving productivity by 40x.

The award-winning Simcenter FLOEFD for NX frontloads computational fluid dynamics (CFD) simulation where it is faster and more cost-effective to evaluate your ideas. Gain insight into the real-life behavior of a wide range of fluids in even the most complex geometries. Evaluate the digital twin with the help of what-if testing and assess the results with the help of numerical values, graphs, images and animations. Use the power of Simcenter FLOEFD for NX with its direct interface to HEEDS Design Space Exploration software to select the most optimal choice.

When needed, Simcenter FLOEFD Flexx, enables you to access multiple CAD systems for simulation - useful for dealing with legacy data or using multiple CAD systems on the same project. With Simcenter FLOEFD for NX the power of CFD simulation is finally in your hands
Simcenter FloEFD for NX.

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.


Product: Siemens Simcenter FloEFD
Version: 2020.1.0 v4949 for NX series
Supported Architectures: x64
Website Home Page :

Code:

Download: Siemens Simcenter FloEFD 2020

Language: multilanguage
System Requirements: PC *
Supported Operating Systems: *
Software Prerequisites: *
Size: 701.8 mb

Supported Platform
- Microsoft Windows 7 Professional, Ultimate or Enterprise 64-bit edition, Microsoft Windows 10 Pro or Enterprise 64-bit (tested with v1809)
- For solver: Microsoft Windows 2012 Server x64, Windows 2012 Server R2 x64, Windows Server 2016, Windows Server 2016 with HPC Pack 2016
- Microsoft Office 2013; Microsoft Office 2010; Microsoft Office 2007
Siemens NX 8.5.1.3, 8.5.2.3, 8.5.3.3
Siemens NX 9.0.1.3, 9.0.2.5, 9.0.3.4
Siemens NX 10.0.0.24, 10.0.2.6, 10.0.3.5
Siemens NX 11.0.0.33,11.0.1.11,11.0.2.7
Siemens NX 12.0.0.27, 12.0.2.9
Siemens NX 1847 Series (1847-1867.xxxx)
Siemens NX 1872 Series (1872-1892.xxxx)
Siemens NX 1899 Series (1899-1915 + )
- Teamcenter (tested version 11.2.3)
- Microsoft Windows Media Player 7.0 or higher
- x64 compatible PC
- Ethernet network adapter
- Mouse or other pointing device
- DVD-ROM drive
- 4GB RAM minimum, more recommended
- 1GB of free hard disk space, more required for simulation models



DOWNLOAD LINKS:

Siemens Simcenter FloEFD 2020.1.0 v4949 for Catia V5 x64






Siemens Simcenter FloEFD 2020.1.0 v4949 for Catia V5 x64 | 758 MB


Language: English, Deutsch, Français, 中文, 日本語, Русский.


Siemens Digital Industries Software announces the latest release of its Simcenter FLOEFD software for Catia V5, a CAD-embedded computational fluid dynamics (CFD) tool. The latest version offers new modules and improvements that can improve accuracy and solve rates.

The new Electronics Cooling Center module in Simcenter FLOEFD combines existing best electronics-specific capabilities and integrates new ones from Simcenter Flotherm software inside the user-friendly CAD-embedded interface to enhance electronics cooling functionality. A second new module helps users create a compact Reduced Order Model (ROM) that solves at a faster rate, while still maintaining a high level of accuracy. Its package creator helps users create thermal models of electronics packages easily and quickly. The Power Electrification module can now simulate an electrical device as an electro-thermal compact model, which can save significant user and computational time.

New Features
The following new features are available in this release.
- BCI ROM. Reduced Order Modelling is an approach to derive a dynamic compact thermal model from a thermal simulation model. The objective is to create a model that solves much faster, while maintaining predictive accuracy in space and time. The Boundary Conditions Independent (BCI) ROM allows you to create the compact model by providing locations of the heat sources (as volume heat sources), temperature monitor points (as point goals), heat transfer coefficients on bounding faces (as wall boundary condition) and specifying a range of heat transfer coefficient minimum and maximum values. After creating the model, the temperature in the monitor points are obtained much faster (in second and minutes) by given exact power dissipation (can be time-dependent) and heat transfer coefficients. The BCI-ROM is a conduction-only model, radiation and Joule heating are not supported. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.

- Thermal Netlist Extraction. Using BCI ROM you can convert a task into a thermal netlist (in *.sp format) which can be used by a Spice based electro thermal system simulation tool such as Mentor Eldo. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.
- Package Creator. Package Creator is a new tool that specializes in the rapid creation of electronic package models based on a library of IC package templates and user customization. An IC package model contains geometry, material and heat sources definition. Requires "BCI-ROM and Package Creator" or "Electronics Cooling Center" module.
- Electrical Element. A thermo-electrical compact model allows the addition of a component into a DC electro-thermal calculation by the given component's electrical resistance. The corresponding Joule heat is calculated and applied to the body as a heat source so you don't need to have a detailed model of a component to take it into account in the electro-thermal DC calculation. A Resistor element uses the total electrical resistance specified. A Wire element automatically calculates the resistance based on a wire's material, length and cross sectional area, and optionally you can specify the thermal resistance of the wire's insulator. A Joint element virtually (no body is necessary) connects two faces. Requires "Power Electrification" or "Electronics Cooling Center" module.
- ECXML Import. You can now import Electronics Cooling XML, an open neutral file format to share design models among different thermal simulation toolsets.
- Battery Model Extraction. Extraction of Equivalent Circuit Model (ECM) input parameters from experimental data. Requires "Power Electrification" module.
- Battery ECM of 3rd order. The 3 rd order ECM is now supported for battery simulation. Requires "Power Electrification" module.
- Multiple Edit for batteries. Multiple edit definition is available for a Battery feature. Requires "Power Electrification" module.
- Import Descriptions from Scene. You can copy a results feature (Descriptions, parameters, etc) to other models by using Scene template or Scene Image (*.efdscene).
- Improvement of setting the Custom Visualization parameters. User-defined postprocessing parameters can now depend on other user-defined postprocessing parameters.
- Rotating angle associated goal. Rotating Region has a new Rotating Angle goal associated with the feature.
- Shock waves stabilization. In case of shock waves with the Mach number greater than five enabling this option allows to dampen oscillations.
- API Enhancement. You can now add the Thermal Contact Resistance, change the Gravity, and change the Default Solid.
- Rebranding FloEFD. FloEFD is now renamed to Simcenter FLOEFD software. FloEFDView is renamed to Simcenter FLOEFD Viewer. FLOEFD icon in Start menu is now located into Simcenter FLOEFD folder. The default files location in the Program Files folder is not changed, so API scripts referring to the setup folder are not affected.
- Simcenter FLOEFD BCI-ROM and Package Creator module.

The module includes the following capabilities:
. BCI-ROM and Thermal Netlist
. Package Creator
. PCB compact model (previously available only in the Electronics Cooling module).
- Simcenter FLOEFD Electronics Cooling Center (ECC) module. The module includes the following best in class capabilities for powerful and comprehensive electronics cooling analysis from Simcenter FLOEFD and Simcenter Flotherm software:
. EDA Bridge and Smart PCB
. BCI ROM and Thermal Netlist
. Package Creator
. PDML Import
. Network Assembly and Two-resistor compact models
. Simcenter T3STER software AutoCalibration
. PCB compact model
. Heat Pipe compact model
. Joule Heating
. Electrical Element compact model
All existing modules whose functionality is available in ECC module (EDA Bridge, AutoCalibration, Electronics Cooling, and Power Electrification) are maintained as separate modules.


Simcenter FLOEFD for CATIA V5 puts the power of computational fluid dynamics (CFD) simulation in the hands of the design engineer. An award-winning software, Simcenter FLOEFD works directly inside your CAD software. Now you can explore the full potential of designs quickly: understand the influence of changes in the geometry or boundary conditions on the results effortlessly, conduct fast and frequent what-if analysis, and generate insightful reports.

Realize the full potential of ideas quickly and save time and money by only progressing the design concepts with the most promise to the validation phase and when you need to use multiple CAD platforms on the same project or for legacy data, you can use Simcenter FLOEFD Flexx - a flexible licensing scheme enabling you to simulate your design in the CAD system of your choice.

Simcenter FLoEFD is a front-loading CFD that is fully embedded in the most Popular CAD programs such a Siemens NX, PTC CREO, CATIA V5 and integrate with your CAD geometry. In this video we'll be looking at a radiator which can be found in many automotive applications.

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.


Product: Siemens Simcenter FloEFD
Version: 2020.1.0 v4949 for CATIA V5
Supported Architectures: x64
Website Home Page :

Code:

Download: Siemens Simcenter FloEFD 2020

Language: multilanguage
System Requirements: PC *
Supported Operating Systems: *
Software Prerequisites: *
Size: 758.0 mb

Supported Platform
- Microsoft Windows 7 Professional, Ultimate or Enterprise 64-bit edition, Microsoft Windows 10 Pro or Enterprise 64-bit (tested with v1809)
- For solver: Microsoft Windows 2012 Server x64, Windows 2012 Server R2 x64, Windows Server 2016 with HPC Pack 2016
- Microsoft Office 2013; Microsoft Office 2010; Microsoft Office 2007
- Microsoft Windows Media Player 7.0 or higher
CATIA V5 R20 (recommended SP7)
CATIA V5 R21 (recommended SP6)
CATIA V5-6 2012 (R22)(recommended SP6)
CATIA V5-6 2013 (R23) (recommended SP6)
CATIA V5-6 2014 (R24) (recommended SP7)
CATIA V5-6 2015 (R25) (recommended SP6)
CATIA V5-6 2016 (R26) (recommended SP6)
CATIA V5-6 2017 (R27) (recommended SP4)
CATIA V5-6 2018 (R28) (recommended SP5)
CATIA V5-6 2019(R29) (recommended SP3)
- Ethernet network adapter
- Mouse or other pointing device
- DVD-ROM drive
- 4GB RAM minimum, more recommended
- 1GB of free hard disk space, more required for simulation models



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